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Classification of packaging
Release date：
2023-04-14
1. According to the number of integrated circuit chips packaged: single chip packaging (scP) and multi chip packaging (MCP); 2. Distinguished by sealing materials: polymer materials (plastic) and ceramics; 3. According to the interconnection method between devices and circuit boards: pin insertion type (PTH) and surface mount type (SMT) 4. According to the pin distribution form: single side pin, double side pin, four side pin, and bottom pin; SMT devices have L-type, J-type, and I-type metal pins. SIP: single line package SQP: miniaturization package MCP: metal can package DIP: dual line package CSP: chip size package QFP: quad flat package PGA: dot matrix package BGA: ball grid array package LCCC: leadless ceramic chip carrier
1. According to the number of integrated circuit chips packaged: single chip packaging (scP) and multi chip packaging (MCP);
2. Distinguished by sealing materials: polymer materials (plastic) and ceramics;
3. According to the interconnection method between devices and circuit boards: pin insertion type (PTH) and surface mount type (SMT) 4. According to the pin distribution form: single side pin, double side pin, four side pin, and bottom pin;
SMT devices have L-type, J-type, and I-type metal pins.
SIP: single line package SQP: miniaturization package MCP: metal can package DIP: dual line package CSP: chip size package QFP: quad flat package PGA: dot matrix package BGA: ball grid array package LCCC: leadless ceramic chip carrier
